ASX - Advanced Semiconductor Engineering Inc.

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ASE Technology Holding Co., Ltd. provides a comprehensive range of semiconductor packaging and testing, as well as electronic manufacturing services across the United States, Taiwan, the rest of Asia, Europe, and other international markets. The company's packaging services include advanced options such as flip chip ball grid array (BGA) and chip scale package (CSP), quad flat packages, and 3D chip packages. They also offer stacked die solutions, copper and silver wire bonding solutions, and a variety of other packaging types designed to meet the diverse needs of the semiconductor industry.

In addition to packaging, ASE Technology offers a broad spectrum of advanced packaging solutions. These include flip chip BGA, heat-spreader FCBGA, flip-chip CSP, hybrid FCCSP, and flip chip package in package (POP). The company also specializes in fan-out wafer-level packaging, SESUB, and 2.5D silicon interposer technologies. Furthermore, they provide system-in-package (SiP) products and modules, interconnect materials, and assemble automotive electronic products, catering to a wide range of industry requirements.

Beyond packaging and assembly, ASE Technology delivers an extensive array of semiconductor testing services. These encompass front-end engineering testing, wafer probing, logic/mixed-signal/RF module testing, and final testing for SiP/MEMS/discrete components. The company also offers real estate development and management, produces substrates, and provides additional services such as information software, equipment leasing, investment advisory, and warehousing management. Incorporated in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology continues to innovate and expand its offerings, maintaining a leading position in the global semiconductor industry.

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